Trusted Platform Module 2.0 SLB 9670: FIPS 140-2 cert #3203

Trusted Platform Module 2.0 SLB 9670, from Infineon Technologies AG, holds FIPS 140-2 certificate #3203 at overall level 2. The validation is historical: agencies may keep the module in existing systems but not buy it new. Below are its validation history, algorithm certificates and security policy, drawn from the NIST CMVP entry.

Certificate

Certificate number	3203
Standard	FIPS 140-2
Status	historical
Overall level	2
Module type	Hardware
Embodiment	Single Chip
Vendor	Infineon Technologies AG · website
Hardware versions	SLB 9670 (Package PG-UQFN-32-1 or PG-VQFN-32-13)
Firmware versions	7.83

Module description

Quoted from the NIST CMVP entry for this certificate.

The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.16, October 2014 (ISO/IEC 11889:2015, Parts 1-4). See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.

Security level exceptions

Physical Security: Level 3
EMI/EMC: Level 3

Approved algorithms (11)

Algorithm	CAVP certificates
AES	5069
CKG	vendor affirmed
CVL	1629, 1630
DRBG	1886
ECDSA	1314
HMAC	3383
KAS	157
KBKDF	172
KTS	vendor affirmed
RSA	2749
SHS	4129

Allowed algorithms

NDRNG

Tested configurations

Validation history

Date	Type	Lab
2018-06-20	Initial	UL Verification Services, Inc.

Status timeline

As observed by this tracker's snapshots. NIST publishes no dates for list moves; observation began 2026-08-21, so earlier changes carry no date.

2026-08-21: first observed by this tracker, status historical
Validation dates on record: 2018-06-20

Trusted Platform Module 2.0 SLB 9670