Trusted Platform Module 2.0 SLB 9670
Caveat: When operated in FIPS mode as specified in Security Policy Sections 1.1 and 8.1
Certificate
| Certificate number | 3203 |
|---|---|
| Standard | FIPS 140-2 |
| Status | historical |
| Overall level | 2 |
| Module type | Hardware |
| Embodiment | Single Chip |
| Vendor | Infineon Technologies AG · website |
| Hardware versions | SLB 9670 (Package PG-UQFN-32-1 or PG-VQFN-32-13) |
| Firmware versions | 7.83 |
Module description
The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.16, October 2014 (ISO/IEC 11889:2015, Parts 1-4). See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.
Security level exceptions
- Physical Security: Level 3
- EMI/EMC: Level 3
Approved algorithms
| Algorithm | CAVP certificate |
|---|---|
| AES | 5069 |
| CKG | vendor affirmed |
| CVL | 1629, 1630 |
| DRBG | 1886 |
| ECDSA | 1314 |
| HMAC | 3383 |
| KAS | 157 |
| KBKDF | 172 |
| KTS | |
| KTS | vendor affirmed |
| RSA | 2749 |
| SHS | 4129 |
Allowed algorithms
NDRNG
Tested configurations
- N/A
Validation history
| Date | Type | Lab |
|---|---|---|
| 2018-06-20 | Initial | UL Verification Services, Inc. |
Status timeline
As observed by this tracker's snapshots. NIST publishes no dates for list moves; observation began 2026-08-21, so earlier changes carry no date.
- 2026-08-21: first observed by this tracker, status historical
- Validation dates on record: 2018-06-20