FIPS 140-2 certificate 3492: Trusted Platform Module 2.0 SLB 9670

Trusted Platform Module 2.0 SLB 9670, from Infineon Technologies AG, holds FIPS 140-2 certificate #3492 at overall level 2. The validation is historical: agencies may keep the module in existing systems but not buy it new. Below are its validation history, algorithm certificates and security policy, drawn from the NIST CMVP entry.

Certificate

Certificate number	3492
Standard	FIPS 140-2
Status	historical
Overall level	2
Module type	Hardware
Embodiment	Single Chip
Vendor	Infineon Technologies AG · website
Hardware versions	SLB 9670 (Package PG-UQFN-32-1 or PG-VQFN-32-13)
Firmware versions	7.85

Module description

Quoted from the NIST CMVP entry for this certificate.

The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.38, September 2016 (ISO/IEC 11889:2015, Parts 1-4), Errata Version 1.4. See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.

Security level exceptions

Physical Security: Level 3
EMI/EMC: Level 3

Approved algorithms (13)

Algorithm	CAVP certificates
AES	C170
CKG	vendor affirmed
CVL	A2424, C170
DRBG	C170
ECDSA	C170
HMAC	C170
KAS	A2424
KAS SSC
KBKDF	C170
KTS
KTS-RSA
RSA	C170
SHS	C170

Allowed algorithms

NDRNG

Tested configurations

Validation history

Date	Type	Lab
2019-07-16	Initial	UL Verification Services, Inc.
2022-09-06	Update	UL Verification Services, Inc.

Status timeline

As observed by this tracker's snapshots. NIST publishes no dates for list moves; observation began 2026-08-21, so earlier changes carry no date.

2026-08-21: first observed by this tracker, status historical
Validation dates on record: 2019-07-16, 2022-09-06

Trusted Platform Module 2.0 SLB 9670