808bits

Trusted Platform Module 2.0 SLI / SLM 9670

FIPS 140-2 certificate #3747 · Infineon Technologies AG · data as of 2026-08-28
Historical. Moved to historical list due to sunsetting. Federal agencies may reference historical validations for existing systems only, not for new procurement.
Caveat: When operated in FIPS mode, initialized, and configured as specified in Sections 8.1, 9 and 10 of the Security Policy

Certificate

Certificate number3747
StandardFIPS 140-2
Statushistorical
Overall level2
Module typeHardware
EmbodimentSingle Chip
VendorInfineon Technologies AG · website
Hardware versionsSLI 9670 (Package PG-VQFN-32-13) and SLM 9670 (Package PG-VQFN-32-13)
Firmware versions13.11

Module description

The TPM is a single chip module that provides computer manufacturers with the core components of a subsystem used to assure authenticity, integrity and confidentiality in e-commerce and internet communications within a Trusted Computing Platform. The TPM is a complete solution implementing the Trusted Platform Module Library Specification, Family "2.0", Level 00, Revision 01.38, September 2016 (ISO/IEC 11889:2015, Parts 1-4), Errata Version 1.4. See http://www.trustedcomputinggroup.org/ for further information on TCG and TPM.

Security level exceptions

  • Physical Security: Level 3
  • EMI/EMC: Level 3

Approved algorithms

AlgorithmCAVP certificate
AESC170
CKGvendor affirmed
CVLA2424, C170
DRBGC170
ECDSAC170
HMACC170
KASA2424
KAS-SSCA2424
KBKDFC170
KTS
KTS-RSA
RSAC170
SHSC170

Allowed algorithms

NDRNG

Tested configurations

  • N/A

Validation history

DateTypeLab
2020-11-24InitialUL Verification Services, Inc.
2022-09-06UpdateUL Verification Services, Inc.

Status timeline

As observed by this tracker's snapshots. NIST publishes no dates for list moves; observation began 2026-08-21, so earlier changes carry no date.

  • 2026-08-21: first observed by this tracker, status historical
  • Validation dates on record: 2020-11-24, 2022-09-06

Source documents